Chapter 376 The dumbfounded guests!
There was a heated discussion and sensation at the scene, and people were shocked by the words that a chip the size of a fingernail had a wire length of tens of thousands of ters.
In this regard, Lin Xuan slowly raised his hand again, making a silent movent.
People who saw Lin Xuan's actions also closed their mouths, so Lin Xuan said slowly:
"Presumably everyone has also learned the concept of resistance, knowing that the longer one of the wires is, the greater the resistance will be.
Although these wires are actually not connected together, but divided into segnts, this does not prevent the fact that he is actually equivalent to a long wire.
In the past, if you were curious about why a small chip can reach a super power of 65 watts, 90 watts or even 120W.
Then you can reduce your curiosity by half now, because you only need to think about the fact that there are tal wires equivalent to tens of thousands of ters long in a chip the size of a fingernail.
Then you know how big the resistance of this thing is, and where most of the heat on the chip cos from. "
Hearing Lin Xuan's words, the people at the scene nodded one after another.
At this point they understand where most of the heat in the chip cos from.
The answer is without a doubt.
The heat source of the chip is not only the heat emitted by the transistor when it is running, but also the tal wire is definitely a big contributor to the heat!
After all, according to their cognition, when the current passes through the conductor, it will generate heat. At this ti, just think about the tens of thousands of ters of wires in the chip the size of a small fingernail.
Then you know that the heat emitted by a wire equivalent to tens of thousands of ters in length cannot be ignored!
“We have developed cobalt interconnection technology before, and this cobalt interconnection technology is not pure high-purity cobalt, but a special cobalt alloy.
This cobalt alloy has better thermal conductivity and lower electrical resistance than single crystal copper.
So we can use cobalt interconnect technology to create chips with more cores, and eventually we can plug more transistors to defeat more advanced manufacturing processes.
But now we can sweep cobalt interconnection technology and copper interconnection technology into the history pile, because we have developed carbon tal wire interconnection technology! "
Hearing Lin Xuan's words, the people at the scene looked at Lin Xuan curiously.
They have just learned that the conductivity of this wire called carbon tal is second only to that of superconductors, but they don't know what the actual effect is?
Although Lin Xuan uttered a bunch of technical terms just now, he uttered paraters such as the intrinsic carrier mobility and maximum current carrying capacity of the carbon tal wire.
But people don't understand these technical terms at all.
People want to know more about using carbon tal wires to connect chip transistors without changing the process technology.
In the end, how many cores and transistors can be packed compared to before!
In this regard, Lin Xuan did not deliberately get stuck, but looked at people's confused eyes. He directly skipped many links and ca to the introduction picture of the chip.
Product Na: Hanfeng 4th Generation Chip
Manufacturing process, 45nm manufacturing process.
Process technology: carbon tal wire interconnection 3D chip stacking technology (5 layers)…
Number of cores: 8 cores
Architecture: The second generation of Hanfeng intelligent architecture
Number of transistors: 3.5 billion!
Hantang AnTuTu CPU running score is 120159 points, GPU running score is 160673 points.
"This…"
Looking at the parater data of the third-generation chip of Hanfeng displayed on the large projection screen, the scene fell into silence.
"Am I reading it wrong? Are you sure the running score you saw is correct? 120,000 points, surpassing the 42,000 points of the Pingguo mobile phone, and surpassing the 25,000 points of the Sanxing S1 mobile phone?"
"Yeah, the above should be wrong, and the number of transistors above should also be wrong.
Actually wrote 3.5 billion. This is a bit exaggerated. It must be a typo. It should be 1.5 billion. "
"That's right, Hantang Technology uses a 45-nanoter manufacturing process. It wants to pack 3.5 billion transistors into a chip the size of a fingernail. How can this be possible!"
"That's right, we must have read it wrong, no, it shouldn't be that we read it wrong, but the person who made this PPT wrote it wrong!"…
There was a burst of heated discussions at the scene. People thought that they had read it wrong or thought that this scene was completely a spoof by the person in charge of making the PPT at Hantang Technology.
However, Lin Xuan then uttered a sentence, which successfully interrupted their fantasy and brought them back to reality:
“As you can see, our carbon tal wire has an ultra-high intrinsic carrier mobility and the highest current carrying capacity compared to the cobalt tal wire.
So under the sa circumstances, our carbon tal wire generates less heat, and has stronger electrical and thermal conductivity, so we can plug more transistors without worrying about heat generation.
The final result is also as you can see, while still using the 45nm process technology.
In a small fingernail chip, we use 5-layer 3D chip stacking technology, and we have packed 3.5 billion transistors! "
"Slap!"
In the auditorium in the front row, the disposable paper cup that Jobs held in his hand slamd onto the table in front of him.
Water splashed, but Jobs' clothes were soaked in an instant.
But at this ti, Jobs still didn't realize it. He just stared blankly at Lin Xuan, with disbelief written in his eyes!
"This is impossible!"
Beside Jobs, Kuke exclaid. At this ti, he also stared at the above paraters in a daze, his eyes full of disbelief.
Beside Kuke, a dignified man looked at Lin Xuan above him with complicated eyes.
"3D chip stacking technology, carbon tal wire interconnection technology... What stupid things did Sanxing do at the beginning!"
Boss Li of Sanxing Electronics had a painful look on his face at this ti. He regretted his behavior of cutting off the supply of Hanfeng first-generation chips.
Because if he had been supplying Hanfeng first-generation chips, but still OEM mobile phone chips for Hantang Technology, he would not have co to this point now!
Will not release Hantang Technology, a raptor, to let him enter the field of chip production, which will eventually cause the bitter fruit in front of him!
At this ti, Boss Li regretted it very much, regretting why he obeyed the orders from Wall Street instead of pushing back forcefully.
If he hadn’t done that at the beginning, Hantang Technology might not have entered the field of chip production, and Sanxing would not have competed with Hantang Technology.
It will not be like it is now, launching the terrifying 3D chip stacking technology and carbon tal wire interconnection technology, successfully defeating 14 nanoters with 45 nanoters...
And this is not the limit of Hantang Technology. There is even more terrible news hidden in it. The use of 3D chip stacking technology and carbon tal wire interconnection technology can defeat 14 nanoters.
What if the process technology of Hantang Technology is upgraded to 32nm or 28nm in the future? How will they deal with these 14nm by then?
Upgrade by 10nm or even 7nm? Can't do it!
14nm has already hollowed out the old Western base, and it is very difficult to enter 10nm!
And the scariest thing is that the mobile phone chip of Hantang Technology is only superimposed with 5 layers of structure. If one more layer or even two layers is added, how many transistors will be stuffed? !
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